CAIG HSC67 Silicone Heat Sink Compound
CAIG Brand Silicone Heat Sink Compound
Transfer Heat Away from Electronic Components and Parts
Thermally conductive compounds are grease like silicone materials, heavily filled with heat-conductive metal oxides. This combination promotes high thermal conductivity, low bleed and high-temperature stability. The compounds are designed to maintain a positive heat sink seal to improve heat transfer from the electrical/electronic device to the heat sink or chassis, thereby increasing the overall efficiency of the device. A cooler device allows for more efficient operation and better reliability over the life of the device. Thermally conductive materials act as a thermal “bridge” to remove heat from a heat source (device) to the ambient via a heat transfer media (i.e. heat sink).
USE: Apply to all mounting and threaded surfaces of the device and chassis.
CONTAINS: Zinc oxide and polydimethyl siloxane.
Transfer heat away from; Heat Sinks, Transistors, Power Diodes, Semi-Conductors Ballast’s & Thermocouple Wells.
Thermal Conductivity: 0.67 Watts per meter K
Specific Gravity: 2.1 @25OC
Silicone and Zinc Oxides
Viscosity: 542000 mPa.s
Shelf Life: 60 months