No clean & rosin flux residue

We are an ATE (semiconductor) company that uses both no-clean and rosin flux in the manufacture of our boards. There is concern that your DeoxIT® GOLD G5, might have compatibility issues with the flux residue.

Basically, we manufacture boards with no-clean flux in the process, and are interested in exploring the possibility of cleaning the gold plated Samtek connectors when our instruments are built or when we open them for repair.

Samtek connectors have little fingers that are held against the gold plating with compression. We are currently cleaning them with alcohol and have had little to no success.

Your DeoxIT® GOLD product works, however, there is some concern with potential adverse chemical reactions with the no-clean solder. It would be used after the soldering process. Please advise.

Regards,

D. Vandervort
.....

Based on what you have stated, there should be no problem with the DeoxIT® GOLD. Just make sure to select one of our 5% versions of the DeoxIT® GOLD, and you should be fine.

Incidentally, in the repair side of the equation, it may be, depending on the level of oxidation present, necessary to first apply DeoxIT® 5%, and then the DeoxIT® GOLD.